Etching Systems

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ICP Etching Systems

ICP Etching system takes advantage of the latest inductively coupled plasma (ICP) technology. Our proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable and uniform etching required for next generation devices.

DRIE Systems

Deep Reactive Ion Etching (DRIE) systems are designed for the BOSCH process (licensed from Robert Bosch GmbH) to achieve superior high-speed, deep, vertical etching of silicon for MEMS and 3D-LSI processes.

RIE Systems

Since our establishment in 1979, we have developed a wealth of dry etching expertise. Today our product line includes, open-load, load-lock, and cassette type systems for both R&D and Mass Production customers.

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

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