Etching Systems


Load-lock Reactive Ion Etching System

RIE-200L dry etching system is designed as a load-locked version of the highly popular RIE-10NR. The RIE-200NL yields excellent etching patterns with minimum side etch for a wide variety of materials such as metals, compound semiconductors (GaAs, GaN, etc.), silicon and poly-silicon.

The system achieves high selectivity for a broad range of mask materials. The RIE-200NL comes with a user friendly computer control system that enables the operator to easily create, edit, store and manage etch recipes.


Main Unit: 546(W) x 1533(D) x 1580(H) mm

Pump Unit: 540(W) x 540(D) x 520(H) mm

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  • Features
  • Applications
  • Provides the capacity to process five 3" wafers, three 4" wafers or one 8" wafer in a compact design

  • The process chamber is isolated from the environment by a load-lock chamber, which improves process reliability and accuracy

  • Affordable pricing that ensures maximum cost effective performance

  • Configured to achieve high speed evacuation of the reaction chamber during the etch process.

  • Superior anisotropic etching performance for silicon films used in ULSI devices

  • Etching of various metal films

  • Etching of compound semiconductors such as GaAs, GaN, etc.

  • Production of waveguide devices

  • Fabrication of micromachines

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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