Etching Systems

DRIE Systems

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DRIE applications: MEMS (Micro Electro Mechanical Systems), 3D packaging, TSV (Through Silicon Via), and the manufacturing of ink jet printer heads, sensors, and medical devices such as μTAS.
For DRIE process data, click here

RIE-400iPB

RIE-400iPB

  • Designed for R&D - easy to use, easy to maintain, low-cost / high-performance package!
  • Up to 4" wafers
  • Deep Silicon etching (Bosch)
  • ESC and helium backside cooling

Details

RIE-800iPB

RIE-800iPB

  • High rate Bosch etching system for up to 8" wafers
  • High-speed gas line system for improved response and smoother sidewalls
  • ESC and helium backside cooling
  • Unique stage design for fast cleaning and reduced downtime

Details

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

TECH NOTES

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