DRIE applications: MEMS (Micro Electro Mechanical Systems), 3D packaging, TSV (Through Silicon Via), and the manufacturing of ink jet printer heads, sensors, and medical devices such as μTAS.
For DRIE process data, click here
- Designed for R&D - easy to use, easy to maintain, low-cost / high-performance package!
- Up to 4" wafers
- Deep Silicon etching (Bosch)
- ESC and helium backside cooling

- High rate Bosch etching system for up to 8" wafers
- High-speed gas line system for improved response and smoother sidewalls
- ESC and helium backside cooling
- Unique stage design for fast cleaning and reduced downtime
