CVD Systems

Plasma Enhanced CVD (PECVD) Systems

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Utilized in compound semiconductor and silicon device fabrication, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are designed for the deposition of insulation and passivation films.
PECVD systems can deposit high-quality silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).

PD-220N

PD-220N

  • SiN and SiO2 film deposition
  • Process up to ø8" wafers
  • Low cost, small footprint
  • Fume hood

Details

PD-220NL

PD-220NL

  • Oxide and Nitride deposition
  • Load-locked PECVD system
  • Process up to ø8" wafers
  • Compact footprint
  • Recipe storage & data logging

Details

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

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