CVD Systems

Plasma Enhanced CVD (PECVD) Systems

HOME > CVD Systems > PECVD (Plasma Enhanced CVD) Systems

Utilized in compound semiconductor and silicon device fabrication, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are designed for the deposition of insulation and passivation films.
PECVD systems can deposit high-quality silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).

PD-220N

PD-220N

  • SiN and SiO2 film deposition
  • Process up to ø8" wafers
  • Low cost, small footprint
  • Fume hood

Details

PD-220NL

PD-220NL

  • Oxide and Nitride deposition
  • Load-locked PECVD system
  • Process up to ø8" wafers
  • Compact footprint
  • Recipe storage & data logging

Details

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

TECH NOTES

Back to Top