> Cleaning Systems > Plasma Cleaners (Remote Plasma) > LFC063
Dimensions:
1363mm(W)×1580mm(D)×1945mm(H)
High throughput single substrate production equipment for various types of chip carrier substrates up to 280×330mm
Same magazine in and out operation
Sophisticated substrate sensing system for most reliable high speed operation
Touchscreen GUI for user-friendly, intuitive operation
Fast and easy size conversion for different substrates
Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
Surface treatment for improvement of gluing, bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology