Cleaning Systems


Plasma Cleaners (Remote Plasma)
The samco-ucp LFC063 is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.



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  • Features
  • Applications
  • High throughput single substrate production equipment for various types of chip carrier substrates up to 280×330mm

  • Same magazine in and out operation

  • Sophisticated substrate sensing system for most reliable high speed operation

  • Touchscreen GUI for user-friendly, intuitive operation

  • Fast and easy size conversion for different substrates

  • Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

  • Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules

  • Surface treatment for improvement of gluing, bonding or encapsulation

  • Mainly surface activation and removal of oxides or organic residues

  • Optimum plasma processing for a variety of materials in semiconductor technology

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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