LFC063
Description
The samco-ucp LFC063 is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.
Dimensions: 1,363 mm (W) x 1,580 mm (D) x 1,945 mm (H)
Key Features and Benefits
- High throughput single substrate production equipment for various types of chip carrier substrates up to 280 mm x 330 mm
- Same magazine in and out operation
- Sophisticated substrate sensing system for most reliable high speed operation
- Touchscreen GUI for user-friendly, intuitive operation
- Fast and easy size conversion for different substrates
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Applications
- Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology
