SuperLiner Wafer
Description
The samco-ucp SuperLiner Wafer is a production type plasma cleaning system designed for surface cleaning of various types of wafers or wafers on Mylar frame. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.
Dimensions: 1,425 mm (W) x 1,650 mm (D) x 2,113 mm (H)
Key Features and Benefits
- High throughput single wafer production equipment up to ø12" wafers
- Left-in, right-out or same magazine in and out operation possible
- State-of-the-art dual-arm robot handler suitable for standard and thin-wafer substrates
- Sophisticated sensing systems for minimum wafer breakage and most reliable operation
- Touchscreen GUI for user-friendly, intuitive operation
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Applications
- Surface cleaning of wafers or thin wafers on Mylar tape with metal frame
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology
