LFC150
Description
The samco-ucp LFC150 is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages typically in magazines. This system operates with a remote plasma source in the downstream process mode. A DC plasma is generated by a hot filament. Via an orifice the plasma beam is injected into the process chamber.
Dimensions: 1,030 mm (W) x 1,250 mm (D) x 2,000 mm (H)
Key Features and Benefits
- Batch volume production equipment for various types of substrates, e.g. wafers and chip carriers in magazines up to ø8" wafers
- Large process chamber, I.D. 630 mm, Height 170 mm
- Manual magazine and substrate loading and unloading
- Touchscreen GUI for user-friendly, intuitive operation
- Ideal for high volume processing of large manufacturing lot sizes
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal
Applications
- Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology
