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Etching Systems
ICP Etching Systems
(Inductively Coupled Plasma Etching)
DRIE Systems
(Deep Reactive Ion Etching)
RIE Systems
(Reactive Ion Etching)
CVD Systems
PECVD Systems
(Plasma Enhanced CVD)
LS-CVD Systems
(Liquid Source CVD)
Cleaning Systems
UV-Ozone Cleaners
Plasma Cleaners
(Direct Plasma)
Plasma Cleaners
(Remote Plasma)
LED
(Light Emitting Diodes)
LD
(Laser Diodes)
MEMS
(Microelectromechanical Systems)
TSV
(Through Silicon Vias)
Power Devices
SAW Devices
RF Devices
Photonic Crystals
Optoelectronics
Electronic Components
Silicon
Surface Treatment
Display Devices
Etching
Tornado ICP
®
Bosch Process
GaN Power Device Etching
GaN / AlGaN Etching
Deposition
LS-CVD
Cleaning
Reversible Electrode Shelf
Remote Plasma Sources
Chemical vs Physical Cleaning
Product Information
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Process Data
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Surface Treatment
Pretreatment for Wire Bonding
[more info]
Processed by
Plasma Cleaner
Pretreatment for Molding
[more info]
Processed by
Plasma Cleaner
Wettability and Adhesion Improvement
[more info]
Processed by
Plasma Cleaner
Surface Treatment of Plastic Circuit Board
[more info]
Processed by
Plasma Cleaner
Product Information
Careers
samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email:
info@samco-ucp.com
samco-ucp ltd. customers
> Process Data
> Surface Treatment
