Application

SAW Device

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Manufacturing Process

Piezo-electric Substrate

SAW Devices

Plasma Cleaning

SuperLiner

Electrode Deposition

SAW Devices

Photolithography

SAW Devices

Dry Etching

RIE-200iPC

Electrode Formation

SAW Devices

Plasma Cleaning

PC-1100

Photo Resist Removal

SAW Devices

Dry Etching

RIE-200C

Trimming (1)

Substrate Etching

SAW Devices

Plasma CVD

PD-220NL

Trimming (2)

Thin Film Deposition

SAW Devices

Plasma CVD

PD-220NL

Insulating Layer Formation

SAW Devices

Dry Etching

RIE-200C

Contact Hole Formation

Etch insulating layer and expose electrode

SAW Devices

Dicing

SAW Devices

Plasma Cleaning

FlexLiner

Packaging

Chip Cleaning after Dicing for Wire-bonding

SAW Devices

SAW Filter

SAW Devices

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

TECH NOTES

Upcoming Exhibitions

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