Application

TSV

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Manufacturing Process

CMP

(Chemical Mechanical Polishing)

TSV

Photolithography

TSV

Deep RIE

RIE-800iPB

Via Hole Formation

Si deep etching by the Bosch Process to create via hole

TSV

LS-CVD

PD-270STL

Insulation film depo-
sition on via hole

Remove PR, Deposit TEOS-SiO2

TSV

Dry Etching

RIE-200C

Exposure of Lower Electrode

Selective etching of TEOS-SiO2

TSV

Barrier Layer Formation

Prevent Cu from spreading by TiN barrier layer

TSV

Formation of Cu plug by plating

TSV

CMP

(Chemical Mechanical Polishing)

TSV

Dry Etching

RIE-200C

RIE-10NR

Exposure of Cu plug by RIE

TSV

LS-CVD

PC-270STL

SiO2 Film Formation

TSV

Photolithography

TSV

Dry Etching

RIE-200C

RIE-10NR

SiO2 Etching

TSV

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

TECH NOTES

Upcoming Exhibitions

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