> Applications > TSV
CMP
(Chemical Mechanical Polishing)
Photolithography
Deep RIE
RIE-800iPB
Via Hole Formation
Si deep etching by the Bosch Process to create via hole
LS-CVD
PD-270STL
Insulation film depo- sition on via hole
Remove PR, Deposit TEOS-SiO2
Dry Etching
RIE-200C
Exposure of Lower Electrode
Selective etching of TEOS-SiO2
Barrier Layer Formation
Prevent Cu from spreading by TiN barrier layer
Formation of Cu plug by plating
RIE-10NR
Exposure of Cu plug by RIE
PC-270STL
SiO2 Film Formation
SiO2 Etching
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