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MEMS

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The wave of MEMS technology is rising, and samco-ucp continues to provide cutting-edge solutions for MEMS applications. samco-ucp’s involvement in the MEMS manufacturing process (shown below) comes in a key step: deep silicon etching. samco-ucp’s DRIE (deep reactive ion etching) systems have proven to be highly effective in the deep, high-speed, anisotropic etching of silicon for MEMS applications.
For MEMS process data, click here

MEMS Process Flow Diagram

Silicon on Insulator (SOI) Substrate

Si, SOI Substrate

Photolithography

MEMS

Si Etching

MEMS

Dry Cleaning

PC-1100

Photo Resist
Removal

MEMS

SiO2 Sacrificial Layer Removal

MEMS

MEMS (Comb Shape)

MEMS
samco-ucp was the first of Japan’s semiconductor process equipment manufacturers to obtain a Bosch Process license, which enabled the development of our DRIE systems. samco-ucp’s RIE-400iPB and RIE-800iPB systems, both using the latest ICP technology and harnessing the Bosch Process, are capable of deep, vertical, high-speed silicon etching required by MEMS devices. Aside from MEMS, samco-ucp’s DRIE systems also serve applications for 3D packaging, TSV (through silicon via), and the manufacturing of ink jet printer heads, sensors, and medical devices such as µTAS.

For MEMS process data, click here

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samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

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