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PECVD (Plasma Enhanced CVD) Systems

Utilized in compound semiconductor and silicon device fabrication, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems are designed for the deposition of insulation and passivation films.
PECVD systems can deposit high-quality silicon-based thin films (SiO2, Si3N4, SiOxNy, a-Si:H).

LS-CVD (Liquid Source CVD) Systems

samco-ucp's LS-CVD (Liquid Source CVD) systems achieve superior step-coverage and gap-fill performance, required for the MEMS, 3D-LSI, and Opto Electronics markets. Importantly, the technology enables deposition at lower temperatures and doesn't require toxic or flammable gases. LS-CVD systems can deposit high-quality TEOS-SiO2, LS-SiN, High-k think film, and Diamond-like-carbon (DLC).

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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