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  • Etching Systems
    • ICP Etching Systems
      (Inductively Coupled Plasma Etching)
    • DRIE Systems
      (Deep Reactive Ion Etching)
    • RIE Systems
      (Reactive Ion Etching)
  • CVD Systems
    • PECVD Systems
      (Plasma Enhanced CVD)
    • LS-CVD Systems
      (Liquid Source CVD)
  • Cleaning Systems
    • UV-Ozone Cleaners
    • Plasma Cleaners
      (Direct Plasma)
    • Plasma Cleaners
      (Remote Plasma)
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  • LED
    (Light Emitting Diodes)
  • LD
    (Laser Diodes)
  • MEMS
    (Microelectromechanical Systems)
  • TSV
    (Through Silicon Vias)
  • Power Devices
  • SAW Devices
  • RF Devices
  • Photonic Crystals
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  • Optoelectronics
  • Electronic Components
  • Silicon
  • Surface Treatment
  • Display Devices
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  • Etching
    • Tornado ICP®
    • Bosch Process
    • GaN Power Device Etching
    • GaN / AlGaN Etching
  • Deposition
    • LS-CVD
  • Cleaning
    • Reversible Electrode Shelf
    • Remote Plasma Sources
    • Chemical vs Physical Cleaning
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  • Product Information
  • Careers

Plasma cleaning improves wire-bonding, adhesion of resin molding, and wettability of underfill in the assembly process of semiconductor circuits, such as BGA, CSP, lead frames.and process assembly and other semiconductor lead frame.
The reversible electrode shelf can meet your various requirements. By reversing the shelf, you can convert RF electrode shelf to ground electrode and vise versa.

Plasma Cleaner, PC-300 is equipped with the Reversible Electrode Shelves and enables easy switch of the plasma mode.
Additionally, PC-300 is simple, low-cost, and high-reliability system.