Etching Systems

ICP Etching Systems

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ICP Etching system takes advantage of the latest inductively coupled plasma (ICP) technology. Our proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable and uniform etching required for next generation devices.

RIE-200iP

RIE-200iP

  • Up to ø8" wafers
  • load-lock type
  • ESC and He backside cooling
  • Small footprint and "all-in-one" design

Details

RIE-400iP

RIE-400iP

  • Process up to ø4" wafers
  • Load-lock type
  • Plasma at low powers and pressure
  • Active temperature control

Details

RIE-600iP

RIE-600iP

  • Process up to ø6" wafers
  • Load-lock type
  • Stable processing at high RF powers and low pressures
  • High capacity vacuum system
  • Height-adjustable lower electrode
  • High voltage ESC

Details

RIE-800iP

RIE-800iP

  • Process up to ø8" wafers
  • Load-lock type
  • Stable processing at high RF powers and low pressures
  • High capacity vacuum system
  • Height-adjustable lower electrode
  • High voltage ESC

Details

RIE-200iPC

RIE-200iPC

  • Processes up to ø8" wafers
  • Cassette-to-cassette type
  • Cassette holds 25x ø8" wafers
  • ESC and Helium backside cooling

Details

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959
Email: info@samco-ucp.com

TECH NOTES

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