ICP Etching system takes advantage of the latest inductively coupled plasma (ICP)
technology. Our proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable
and uniform etching required for next generation devices.
- Up to ø8" wafers
- load-lock type
- ESC and He backside cooling
- Small footprint and "all-in-one" design
- Process up to ø4" wafers
- Load-lock type
- Plasma at low powers and pressure
- Active temperature control
- Process up to ø8" wafers
- Load-lock type
- Stable processing at high RF powers and low pressures
- High capacity vacuum system
- Height-adjustable lower electrode
- High voltage ESC
- Processes up to ø8" wafers
- Cassette-to-cassette type
- Cassette holds 25x ø8" wafers
- ESC and Helium backside cooling
> Etching Systems
> ICP (Inductively Coupled Plasma) Etching Systems
