> Etching Systems
> RIE (Reactive Ion Etching) Systems
> RIE-100C
RIE-100C is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage.
The RIE-100C is a cassette-to-cassette system designed for high-volume manufacturing, based on the field-proven RIE-10NR. This system is designed to process wafers up to φ4".
High volume manufacturing
Fully automatic "one-button" operation with full manual override
Easy-to-use computerized touch panel for parameter control, recipe entry and storage
Process wafers up to ø4" in diameter
A single-arm robot performs automated loading/unloading of wafers from cassettes
Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride
Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, SiN, GaAs and Mo
Manufacturing of micromachines
