Etching Systems


Reactive Ion Etching System
RIE-10NR is a low-cost, high-performance, fully automatic, dry etching system that meets the most demanding process requirements using fluorine chemistry. A computerized touch panel provides user-friendly interface for parameter control and recipe storage.
Etching is performed with minimum sidewall deterioration and a high selectivity between materials. With its sleek, compact design, the RIE-10NR system requires minimal clean room space. 


Main Unit: 500(W) x 920(D) x 1510(H) mm

Pump Unit: 522(W) x 163(D) x 216(H) mm

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  • Features
  • Applications
  • Highly selective anisotropic etching

  • Fully automatic "one-button" operation with full manual override

  • Easy-to-use computerized touch panel for parameter control, recipe entry and storage

  • Process wafers up to ø8" in diameter

  • Sleek, compact design uses minimal clean room space

  • Stripping of passivation materials including silicon nitride, silicon dioxide and silicon oxynitride

  • Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, Si3N4, GaAs and Mo

  • Manufacturing of micromachines

  • Failure analysis

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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