RIE-200iPC

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Inductively Coupled Plasma (ICP) Etching System
RIE-200iPC is a cassette-to-cassette ICP etching system for production applications. The system features a proprietary tornado coil electrode design that efficiently generates a stable high-density plasma which ensures high selectivity, superior etching precision and excellent uniformity. The RIE-200iPC is ideal for applications that require high speed deep etching of silicon oxide and compound semiconductor films such as InP, GaN, AlGaAs and GaAs.
SAMCO also manufactures Model RIE-230iPC which is an automated cassette-to-cassette system that can process batches of twelve 2" wafers or three 4" wafers.

Dimensions:

Main Unit: 1206mm (W) x 2015mm (D) x 2063.5mm (H)

Direct transfer of max. φ8" wafers
Cassette-to-cassette production type system
Active wafer temperature control (Helium backside cooling)
Electrostatic chuck for wafer clamping
Processing of multiple wafers possible using the tray cassette
Fully automatic operation using graphical touch panel screen
Data management and recipe management
Data logging is possible with use of an optional PC

Low-damage etching of GaN, GaAs, InP for production of electronic and light emitting devices
Etching of ferroelectric materials for memory devices
High-speed etching for micromachine production