RIE-400iP

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ICP Etching System
RIE-400iP is a load-lock type etching system designed for the precise and highly uniform etching of various semiconductor and dielectric films, and can process up to φ4" wafers and smaller pieces. samco-ucp's proprietary "Tornado Coil" ICP electrode enables the generation of highly uniform, high density plasma. Users can choose between two ICP sources in order to optimize process results for various materials and applications.

Vertical sidewalls with excellent uniformity InP Etching
Single wafer processing for up to ø4" round wafers
Tornado ICP allows easy plasma discharge at low powers and pressures
Original Vacuum system allows for precise vacuum control and stability
Lower Damage highly chemical etching from low ICP powers
Active temperature control of sample stage and inner wall of the reaction chamber
Interferometric endpoint detection system (optional)

Fabrication of laser diodes
Etching of GaN, GaAs, and InP
LD ridge formation
Photonic crystal devices
Quantum dot devices