Etching Systems


Inductively Coupled Plasma Etching System

The RIE-800iP is an ICP (Inductively Coupled Plasma) etching system capable of generating a high density plasma. The system features a high conductance vacuum system coupled with precise pressure control to allow processing at both low and high pressures, and low and high gas flows. Furthermore, with a newly developed Tornado ICP coil, maintaining stable plasma at high RF powers and high vacuums is now possible. Together, these features provide users the widest process window available.


1000mm(W) ×1826mm(D) ×1850mm(H)

Contact Us

  • Features
  • Applications
  • Newly developed Tornado ICP coil enables stable processing at high RF powers and low pressures.

  • High capacity vacuum system allows low processing pressure even with high gas flows.

  • Height-adjustable lower electrode (air operated) enables optimization of the distance between the wafer and ICP plasma source.

  • High voltage ESC (electrostatic chuck) allows for clamping of non-conductive substrates such as quartz.

  • Easy maintenance design.

  • High RF power and high etching rate process
    (e.g. GaN high rate etching, full Si wafer etching

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


Back to Top