RIE-800iPB

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DRIE System
RIE-800iPB is a high performance inductively coupled plasma (ICP) etching system that uses high-density plasma to perform deep silicon etching required by MEMS and TSV applications.
The RIE-800iPB is a dedicated silicon etching system specifically designed for the BOSCH process (licensed from Robert Bosch GmbH). The systems' unique reaction chamber, electrode, stage and vacuum design overcomes the problems encountered in competing systems to allow High Rate (~50 μm/min), Tilt Free, High Aspect Etching with industry leading selectivity (~250:1).

8" wafer processing (other sizes available)
Manual wafer loading, automated robot transfer to load-lock chamber
ESC with Active wafer temperature control (Helium backside cooling)
High-speed gas line system for improved response and smoother sidewalls
'Anti-tilt' feature for vertical etching across the entire wafer
Notch Prevention Package for SOI applications (option)
Unique stage design for fast cleaning and reduced downtime
Recipe storage and data logging

Manufacturing of MEMS devices
Etching of via holes for 3D packaging
Manufacturing of sensors
Silicon wafer dicing