> CVD Systems
> LS-CVD (Liquid Source CVD) Systems
> PD-270STL
The PD-270STL is a load-lock Plasma-Enhanced CVD system utilizing a liquid TEOS source to deposit SiO2 films at high speed using a low temperature process.
The strong sheath electrical field surrounding the cathode-coupled sample stage generates a high level of ion energy, which enables the deposition of silicon oxide films with low internal stress, from thin films to thick films (~30 μm).
High deposition rates (3000-5000 Å/min.)
Enables deposition on larges steps (200 μm) with high aspect ratios
samco-ucp's liquid source TEOS deposition technology results in superior step-coverage and gap-fill performance
Low Particle Levels - A unique reaction chamber design minimizes the generation of particles within the reaction chamber
Control of Refractive Index - Germanium (Ge), Phosphorus, and Boron liquid source materials can be used to achieve control over the refractive index
Fully automatic "one-button" operation time with full manual override
High-speed deposition of thick silicon oxide films (up to 30 μm)
Fabrication of optical waveguides
Fabrication of etch masks for micromachining
Deposition of films on plastic surfaces
Low temperature deposition (from ambient to 300°C)
