CVD Systems


Liquid Source CVD System - Load Lock

The PD-270STL is a load-lock Plasma-Enhanced CVD system utilizing a liquid TEOS source to deposit SiO2 films at high speed using a low temperature process.
The strong sheath electrical field surrounding the cathode-coupled sample stage generates a high level of ion energy, which enables the deposition of silicon oxide films with low internal stress, from thin films to thick films (~30 μm).

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  • Features
  • Applications
  • High deposition rates (3000-5000 Å/min.)

  • Enables deposition on larges steps (200 μm) with high aspect ratios

  • samco-ucp's liquid source TEOS deposition technology results in superior step-coverage and gap-fill performance

  • Low Particle Levels - A unique reaction chamber design minimizes the generation of particles within the reaction chamber

  • Control of Refractive Index - Germanium (Ge), Phosphorus, and Boron liquid source materials can be used to achieve control over the refractive index

  • Fully automatic "one-button" operation time with full manual override

  • High-speed deposition of thick silicon oxide films (up to 30 μm)

  • Fabrication of optical waveguides

  • Fabrication of etch masks for micromachining

  • Deposition of films on plastic surfaces

  • Low temperature deposition (from ambient to 300°C)

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samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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