UV-2

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Bench top UV-Ozone Cleaning System
The UV-2 is a compact, high-performance, bench top, UV-Ozone Cleaning system. The UV-2 is modular in design and can be configured specifically, upon order, for a number of cleaning, stripping or UV-curing applications. This system is drawer loaded and uses patented technology to uniformly distribute ozone and UV light over the surface of wafers or other substrates. The system employs a programmable logic controller and safety interlocks to protect the operator from hazardous exposure to process ozone and UV light.
This easy to operate system uses a unique combination of ultraviolet radiation, ozone and heat to gently, yet effectively, remove organic materials from a variety of substrates including silicon, gallium arsenide (GaAs), Sapphire, metals, ceramics, quartz and glass.
The versatile UV-2 is well-suited for a variety of applications such as substrate cleaning, photoresist descumming, improving wettability, and UV curing. By operating at atmospheric pressure, the UV-2 eliminates the need for a cumbersome, high-maintenance vacuum system. This system is CE marked and UL certified.

Dimensions:

Main Unit: 610(W) x 572(D) x 426(H) mm

Accommodates a variety of wafer sizes up to 8 inches in diameter
Compact, uses minimum bench top space
Heated sample stage increases cleaning/stripping rates
Broad process temperature range (Ambient to 300°C)
Completely dry process and will not cause any electrical damage to circuits
Operates at atmospheric pressure - no vacuum system required
Drawer interlock system guarantees system is inoperable when drawer is open
Automatic nitrogen purging system purges the UV-2 chamber after every run
Built-in ozone catalyst ("ozone killer") unit
Sealed chamber during process prevents device contamination from atmospheric air

Removing organic contamination
Pre-clean wafers prior to deposition (e.g. GaAs prior to MBE, sapphire prior to HgCdTe)
Descumming photoresist and polyimide
Modifying surfaces for better adhesion
Final cleaning before wafer bonding
UV curing
Growth of thin stable oxide films (Ge, Si)
Cleaning of AFM tips