FlexLiner II

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Plasma Cleaners (Remote Plasma)
The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.

Dimensions:

1520mm(W)× 1410mm(D)× 2130mm(H)

Single substrate production equipment for various types and dimensions of substrates and magazines up to 300x300mm
Gentle handling with minimal movement of substrates and magazines
Touchscreen GUI for user-friendly, intuitive operation
Multiple sensor controls for highly reliable operation
High throughput due to simultaneous (un)loading and plasma processing
Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
Surface treatment for improvement of gluing, bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology