FlexLiner

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Plasma Cleaners (Remote Plasma)
The samco-ucp FlexLiner is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.

Dimensions:

1415mm(W)× 1162mm(D)× 1810mm(H)

Single substrate volume production equipment for various types of chip carrier substrates up to 330×330mm
Left-in, right-out or same magazine in and out operation possible
Extremely gentle substrate handling with minimal movement of substrates and magazines
Touchscreen GUI for user-friendly, intuitive operation
Ideal for large substrate and / or magazine size
Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
Surface treatment for improvement of gluing, bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology