LFC150

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Plasma Cleaners (Remote Plasma)
The samco-ucp LFC150 is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages typically in magazines.
This system operates with a remote plasma source in the downstream process mode. A DC plasma is generated by a hot filament. Via an orifice the plasma beam is injected into the process chamber.

Dimensions:

1030mm(W)× 1250mm(D)× 2000mm(H)

Batch volume production equipment for various types of substrates, e.g. wafers and chip carriers in magazines up to ø8" wafers
Large process chamber
I.D. 630mm, Height 170mm
Manual magazine and substrate loading and unloading
Touchscreen GUI for user-friendly, intuitive operation
Ideal for high volume processing of large manufacturing lot sizes
Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
Surface treatment for improvement of gluing, bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology