SuperLiner Wafer

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Plasma Cleaners (Remote Plasma)
The samco-ucp SuperLiner Wafer is a production type plasma cleaning system designed for surface cleaning of various types of wafers or wafers on Mylar frame.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.

Dimensions:

1425mm(W)× 1650mm(D)× 2113mm(H)

High throughput single wafer production equipment up to ø12" wafers
Left-in, right-out or same magazine in and out operation possible
State-of-the-art dual-arm robot handler suitable for standard and thin-wafer substrates
Sophisticated sensing systems for minimum wafer breakage and most reliable operation
Touchscreen GUI for user-friendly, intuitive operation
Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Surface cleaning of wafers or thin wafers on Mylar tape with metal frame
Surface treatment for improvement of gluing, bonding or encapsulation
Mainly surface activation and removal of oxides or organic residues
Optimum plasma processing for a variety of materials in semiconductor technology