Cleaning Systems

SuperLiner Wafer

Plasma Cleaners (Remote Plasma)
The samco-ucp SuperLiner Wafer is a production type plasma cleaning system designed for surface cleaning of various types of wafers or wafers on Mylar frame.
This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head.


1425mm(W)× 1650mm(D)× 2113mm(H)

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  • Features
  • Applications
  • High throughput single wafer production equipment up to ø12" wafers

  • Left-in, right-out or same magazine in and out operation possible

  • State-of-the-art dual-arm robot handler suitable for standard and thin-wafer substrates

  • Sophisticated sensing systems for minimum wafer breakage and most reliable operation

  • Touchscreen GUI for user-friendly, intuitive operation

  • Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

  • Surface cleaning of wafers or thin wafers on Mylar tape with metal frame

  • Surface treatment for improvement of gluing, bonding or encapsulation

  • Mainly surface activation and removal of oxides or organic residues

  • Optimum plasma processing for a variety of materials in semiconductor technology

Contact Us

samco-ucp ltd.
Industriering 10 LI-9491 Ruggell Liechtenstein
Phone: 423-377-5959


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